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Patent Information


Title
半導体装置および半導体チップ 
Author
Takayuki Ohba.  
Kind
Patent 
Status
Published 
Applicant
国立大学法人東京科学大学.  
Filing Date
2023/10/17
Application Number
特願2023-178976
Unexamined Application Date
2025/04/30
Publication Number
特開2025-068884

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