Science Tokyo Research Repository (T2R2)

Patent Information

Title

半導体装置および半導体チップ

Author

Kind

Patent

Status

Published

Applicant

国立大学法人東京科学大学.

Filing Date

2024/12/10

Application Number

PCT/JP2024/043661

Unexamined Application Date

2025/04/24

Publication Number

WO 2025/084440

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