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Title
Japanese:分子動力学法によるCu薄膜の融解における厚さの影響 
English: 
Author
Japanese: 石垣智子, 小嶋理恵, 須佐匡裕.  
English: 石垣智子, Rie Kojima, Masahiro Susa.  
Language Japanese 
Journal/Book name
Japanese: 
English:材料とプロセス 
Volume, Number, Page Vol. 18    No. 4    pp. PS7
Published date 2005 
Publisher
Japanese: 
English: 
Conference name
Japanese:日本鉄鋼協会講演大会 
English: 
Conference site
Japanese: 
English: 

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