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Publication Information
Title
Japanese:
English:
Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding
Author
Japanese:
H.Yokoi,
水本 哲弥
, M.Shimizu, T.Waniishi, N.Futakuchi, N.Kaida, Y.Nakano.
English:
H.Yokoi,
T.Mizumoto
, M.Shimizu, T.Waniishi, N.Futakuchi, N.Kaida, Y.Nakano.
Language
English
Journal/Book name
Japanese:
English:
196th Meeting of the Electrochemical Society Meeting Abstracts
Volume, Number, Page
Vol. 1 No. 990
Published date
Oct. 1999
Publisher
Japanese:
English:
Conference name
Japanese:
English:
Conference site
Japanese:
English:
©2007
Tokyo Institute of Technology All rights reserved.