Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding

Publication Information

Title

Japanese:
English:	Contact angle measurement of wafer surfaces for integrating laser diode and optical isolator by wafer bonding

Author

Japanese:	H.Yokoi, 水本哲弥, M.Shimizu, T.Waniishi, N.Futakuchi, N.Kaida, Y.Nakano.
English:	H.Yokoi, T.Mizumoto, M.Shimizu, T.Waniishi, N.Futakuchi, N.Kaida, Y.Nakano.

Language

English

Journal/Book name

Japanese:
English:	196th Meeting of the Electrochemical Society Meeting Abstracts

Volume, Number, Page

Vol. 1 No. 990

Published date

Oct. 1999

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: