Wafer surface treatment for integrating laser diode and optical isolator by direct bonding

Publication Information

Title

Japanese:
English:	Wafer surface treatment for integrating laser diode and optical isolator by direct bonding

Author

Japanese:	水本哲弥, H.Yokoi, M.Shimizu, T.Waniishi, N.Futakuchi, N.Kaida, Y.Nakano.
English:	T.Mizumoto, H.Yokoi, M.Shimizu, T.Waniishi, N.Futakuchi, N.Kaida, Y.Nakano.

Language

English

Journal/Book name

Japanese:
English:	APCC/OECC'99, Proceedings

Volume, Number, Page

Vol. 2 pp. 1662-1664

Published date

Oct. 1999

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:	Beijing