固相接合における界面拡散の過渡現象とその接合促進効果（第二報）

Publication Information

Title

Japanese:	固相接合における界面拡散の過渡現象とその接合促進効果（第二報）
English:	Transient behaviour in the solid state bonding and the enhancement effect on the bonding process (Part 2)

Author

Japanese:	西口公之, 高橋康夫, 高橋邦夫.
English:	西口公之, 高橋康夫, KUNIO TAKAHASHI.

Language

Japanese

Journal/Book name

Japanese:	溶接学会全国大会講演概要
English:

Volume, Number, Page

Vol. 37 pp. 52-53

Published date

1985

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: