Improved heat treatment for wafer direct bonding between semiconductors and magnetic garnets

Publication Information

Title

Japanese:
English:	Improved heat treatment for wafer direct bonding between semiconductors and magnetic garnets

Author

Japanese:	H.Yokoi, 水本哲弥, K.Maru, Y.Naito.
English:	H.Yokoi, T.Mizumoto, K.Maru, Y.Naito.

Language

English

Journal/Book name

Japanese:
English:	Japanese Journal of Applied Physics

Volume, Number, Page

Vol. 36 No. 5A pp. 2784-2787

Published date

May 1997

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI