Effect of Intermetallic Compound Layer Development on Interfacial Strength of Solder Joints

Publication Information

Title

Japanese:
English:	Effect of Intermetallic Compound Layer Development on Interfacial Strength of Solder Joints

Author

Japanese:	M. Omiya, K. Kishimoto, T. Shibuya, M. Amagai.
English:	M. Omiya, K. Kishimoto, T. Shibuya, M. Amagai.

Language

English

Journal/Book name

Japanese:
English:	Proceedings of IPACK'01, The Pscific Rim/ASME International Electronic Packaging Technical Conference and Exibition, July 8-13, 2001, Kauai, Hawaii, USA（IPACK2001-15556 in CD-ROM）

Volume, Number, Page

Vol. CR-ROM

Published date

2001

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: