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Publication Information
Title
Japanese:
マルチステージピール試験によるCu薄膜の界面はく離強度評価
English:
Author
Japanese:
大宮正毅, 井上裕嗣,
岸本喜久雄
, 雨海正純.
English:
大宮正毅, 井上裕嗣,
岸本喜久雄
, 雨海正純.
Language
Japanese
Journal/Book name
Japanese:
日本機械学会材料力学部門講演会講演論文集
English:
Volume, Number, Page
pp. 245-246
Published date
2002
Publisher
Japanese:
English:
Conference name
Japanese:
English:
Conference site
Japanese:
English:
©2007
Tokyo Institute of Technology All rights reserved.