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Title
Japanese:マルチステージピール試験によるCu薄膜の界面はく離強度評価 
English: 
Author
Japanese: 大宮正毅, 井上裕嗣, 岸本喜久雄, 雨海正純.  
English: 大宮正毅, 井上裕嗣, 岸本喜久雄, 雨海正純.  
Language Japanese 
Journal/Book name
Japanese:日本機械学会材料力学部門講演会講演論文集 
English: 
Volume, Number, Page         pp. 245-246
Published date 2002 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
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Conference site
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