Effect of Intermetallic Compound Layer Development on Mechanical Strength of Lead Free Solder Joints

Publication Information

Title

Japanese:
English:	Effect of Intermetallic Compound Layer Development on Mechanical Strength of Lead Free Solder Joints

Author

Japanese:	Kikuo Kishimoto, Masaki Omiya, Masazumi Amagai.
English:	Kikuo Kishimoto, Masaki Omiya, Masazumi Amagai.

Language

English

Journal/Book name

Japanese:
English:	TMS 2003 International Metals & Materials Exhibition, 132nd Annual Meeting & Exhibition

Volume, Number, Page

pp. 430

Published date

2003

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: