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Publication Information
Title
Japanese:
English:
On-chip/Off-chip High Density Transmission Line Interconnect
Author
Japanese:
益 一哉
, Kenichi Okada, Hiroyuki Ito.
English:
Kazuya Masu
, Kenichi Okada, Hiroyuki Ito.
Language
English
Journal/Book name
Japanese:
English:
Volume, Number, Page
pp. 398-401
Published date
Jan. 2006
Publisher
Japanese:
English:
Conference name
Japanese:
English:
International Conference on Electronics Packaging
Conference site
Japanese:
English:
東京
©2007
Institute of Science Tokyo All rights reserved.