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Title
Japanese: 
English:On-chip/Off-chip High Density Transmission Line Interconnect 
Author
Japanese: 益 一哉, Kenichi Okada, Hiroyuki Ito.  
English: Kazuya Masu, Kenichi Okada, Hiroyuki Ito.  
Language English 
Journal/Book name
Japanese: 
English: 
Volume, Number, Page         pp. 398-401
Published date Jan. 2006 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English:International Conference on Electronics Packaging 
Conference site
Japanese: 
English:東京 

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