Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology for One-Chip Wireless Communication Circuits

Publication Information

Title

Japanese:
English:	Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology for One-Chip Wireless Communication Circuits

Author

Japanese:	Junki Seita, Hiroyuki Ito, Hideyuki Sugita, Kenichi Okada, Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Kazuya Masu.
English:	Junki Seita, Hiroyuki Ito, Hideyuki Sugita, Kenichi Okada, Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Kazuya Masu.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

pp. 338-341

Published date

Jan. 2006

Publisher

Japanese:
English:

Conference name

Japanese:
English:	IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems

Conference site

Japanese:
English:	San Diego, California