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Publication Information
Title
Japanese:
English:
Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology for One-Chip Wireless Communication Circuits
Author
Japanese:
Junki Seita, Hiroyuki Ito, Hideyuki Sugita, Kenichi Okada, Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato,
Kazuya Masu
.
English:
Junki Seita, Hiroyuki Ito, Hideyuki Sugita, Kenichi Okada, Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato,
Kazuya Masu
.
Language
English
Journal/Book name
Japanese:
English:
Volume, Number, Page
pp. 338-341
Published date
Jan. 2006
Publisher
Japanese:
English:
Conference name
Japanese:
English:
IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
Conference site
Japanese:
English:
San Diego, California
©2007
Tokyo Institute of Technology All rights reserved.