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Title
Japanese: 
English:Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology 
Author
Japanese: 伊藤 浩之, Hideyuki Sugita, 岡田 健一, Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Ryozo Yamauchi, 益 一哉.  
English: Hiroyuki Ito, Hideyuki Sugita, Kenichi Okada, Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Ryozo Yamauchi, Kazuya Masu.  
Language English 
Journal/Book name
Japanese: 
English:IEICE Transactions on Electronics 
Volume, Number, Page Vol. E90-C    No. 3    pp. 641-643
Published date Mar. 2007 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 
DOI https://doi.org/10.1093/ietele/e90-c.3.641

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