Improved heat treatment in wafer direct bonding for optical isolator integration

Publication Information

Title

Japanese:
English:	Improved heat treatment in wafer direct bonding for optical isolator integration

Author

Japanese:	H.Yokoi, 水本哲弥, Y.Naito.
English:	H.Yokoi, Tetsuya MIZUMOTO, Y.Naito.

Language

English

Journal/Book name

Japanese:
English:	2nd Optoelectronics and Communications Conference (OECC '97) Technical Digest

Volume, Number, Page

No. 10D1-4 pp. 484-485

Published date

July 1997

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:	Seoul, Korea