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Title
Japanese: 
English:Fabrication of high-performance on-die passives based on multi-Cu-layer WLP processes 
Author
Japanese: Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Takuya Aizawa, Oasmu Nakao, Takashi Takizawa, 岡田 健一, 益 一哉, Tatsuya Ito.  
English: Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Takuya Aizawa, Oasmu Nakao, Takashi Takizawa, Kenichi Okada, Kazuya Masu, Tatsuya Ito.  
Language English 
Journal/Book name
Japanese: 
English: 
Volume, Number, Page        
Published date Nov. 2005 
Publisher
Japanese: 
English: 
Conference name
Japanese:International Wafer-Level Packaging Congress 
English: 
Conference site
Japanese:San Jose, CA 
English: 

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