Understanding of adhesion phenomena and its application to grip-and-release devices

Publication Information

Title

Japanese:
English:	Understanding of adhesion phenomena and its application to grip-and-release devices

Author

Japanese:	高橋邦夫.
English:	KUNIO TAKAHASHI.

Language

English

Journal/Book name

Japanese:
English:	Proceedings of the 1st international IEEE workshop on Low Temperature Bonding for 3D Integration

Volume, Number, Page

pp. 115-160

Published date

July 2008

Publisher

Japanese:
English:

Conference name

Japanese:
English:	the 1st international IEEE workshop on Low Temperature Bonding for 3D Integration

Conference site

Japanese:
English:	Tokyo