RF CMOS Circuits with Wafer-Level Packaging Inductors

Publication Information

Title

Japanese:
English:	RF CMOS Circuits with Wafer-Level Packaging Inductors

Author

Japanese:	畠山英樹, Yusuke Uemichi, 大橋一磨, 福田聡, 伊藤浩之, 岡田健一, Tatsuya Ito, 益一哉.
English:	Hideki Hatakeyama, Yusuke Uemichi, Kazuma Ohashi, Satoshi Fukuda, Hiroyuki Ito, Kenichi Okada, Tatsuya Ito, Kazuya Masu.

Language

English

Journal/Book name

Japanese:
English:	International Wafer-Level Packaging Conference

Volume, Number, Page

pp. 69-73

Published date

Oct. 2008

Publisher

Japanese:
English:

Conference name

Japanese:
English:	International Wafer-Level Packaging Conference

Conference site

Japanese:
English:	San Jose, California, USA