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Publication Information
Title
Japanese:
English:
SMAFTI Packaging Technology for New Interconnect Hierarchy
Author
Japanese:
栗田洋一郎
,
もとはし N
,
まつい S
,
そえじま K.
,
天川 修平
,
益 一哉
,
かわの M
.
English:
Youichiro. Kurita
,
N. Motohashi
,
S. Matsui
,
K. Soejima
,
S. Amakawa
,
K. Masu
,
M. Kawano
.
Language
English
Journal/Book name
Japanese:
English:
International Interconnect Technology Conference (IITC)
Volume, Number, Page
pp. 220-222
Published date
June 2009
Publisher
Japanese:
English:
International Interconnect Technology Conference (IITC)
Conference name
Japanese:
English:
International Interconnect Technology Conference (IITC)
Conference site
Japanese:
English:
Sapporo, Japan
File
DOI
https://doi.org/10.1109/IITC.2009.5090393
©2007
Institute of Science Tokyo All rights reserved.