SMAFTI Packaging Technology for New Interconnect Hierarchy

Publication Information

Title

Japanese:
English:	SMAFTI Packaging Technology for New Interconnect Hierarchy

Author

Japanese:	栗田洋一郎, もとはし N, まつい S, そえじま K., 天川修平, 益一哉, かわの M.
English:	Youichiro. Kurita, N. Motohashi, S. Matsui, K. Soejima, S. Amakawa, K. Masu, M. Kawano.

Language

English

Journal/Book name

Japanese:
English:	International Interconnect Technology Conference (IITC)

Volume, Number, Page

pp. 220-222

Published date

June 2009

Publisher

Japanese:
English:	International Interconnect Technology Conference (IITC)

Conference name

Japanese:
English:	International Interconnect Technology Conference (IITC)

Conference site

Japanese:
English:	Sapporo, Japan

File

DOI