A Low-Power Differential Transmission Line Interconnect using Wafer Level Package Technology

Publication Information

Title

Japanese:
English:	A Low-Power Differential Transmission Line Interconnect using Wafer Level Package Technology

Author

Japanese:	前川智明, 石井隆宏, 清田淳紀, 伊藤浩之, 岡田健一, 畠山英樹, 上道雄介, Tatsuya Ito, Ryozo Yamauchi, 益一哉.
English:	Tomoaki Maekawa, Takahiro Ishii, Junki Seita, Hiroyuki Ito, Kenichi Okada, Hideki Hatakeyama, Y.Uemichi, Tatsuya Ito, Ryozo Yamauchi, Kazuya Masu.

Language

English

Journal/Book name

Japanese:
English:	IEEE Workshop on Signal Propagation on Interconnects (SPI)

Volume, Number, Page

Published date

May 2008

Publisher

Japanese:
English:

Conference name

Japanese:
English:	IEEE Workshop on Signal Propagation on Interconnects (SPI)

Conference site

Japanese:
English:	Avignon, France

DOI