Integration of the passive element above IC wafers by applying Wafer Level Package technology

Publication Information

Title

Japanese:
English:	Integration of the passive element above IC wafers by applying Wafer Level Package technology

Author

Japanese:	Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, 岡田健一, 益一哉.
English:	Tatsuya Ito, Kazuhisa Itoi, Masakazu Sato, Hiroshi Abe, Kenichi Okada, Kazuya Masu.

Language

English

Journal/Book name

Japanese:
English:	3rd International Workshop on High Frequency Micromagnetic Devices and Materials

Volume, Number, Page

pp. 29-30

Published date

Apr. 2005

Publisher

Japanese:
English:

Conference name

Japanese:
English:	3rd International Workshop on High Frequency Micromagnetic Devices and Materials

Conference site

Japanese:
English:	Sendai, Japan