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Title
Japanese: 
English:Design of On-Chip High Speed Interconnect on CMOS 180nm Technology 
Author
Japanese: 大下 隆生, 天川 修平, 石原 昇, 益 一哉.  
English: Takao Oshita, Shuhei Amakawa, Noboru Ishihara, Kazuya Masu.  
Language English 
Journal/Book name
Japanese: 
English:Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials 
Volume, Number, Page         pp. 64-65
Published date Oct. 2009 
Publisher
Japanese:応用物理学会 
English:2009 International Conference on Solid State Devices and Materials 
Conference name
Japanese: 
English:2009 International Conference on Solid State Devices and Materials (SSDM) 
Conference site
Japanese: 
English:Sendai, Japan 

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