電気めっきの境界要素シミュレーション(LSI銅配線への応用)

Publication Information

Title

Japanese:	電気めっきの境界要素シミュレーション(LSI銅配線への応用)
English:	Boundary Element Simulation of Electroplating on Silicon Wafer

Author

Japanese:	天谷賢治.
English:	KENJI AMAYA.

Language

Japanese

Journal/Book name

Japanese:	表面技術 = The Journal of the Surface Finishing Society of Japan
English:	The Journal of the Surface Finishing Society of Japan

Volume, Number, Page

Vol. 51 No. 4 pp. 425-430

Published date

2000

Publisher

Japanese:	表面技術協会
English:	表面技術協会

Conference name

Japanese:
English:

Conference site

Japanese:	9151869
English:

Official URL