&quot;2111 半導体めっきにおける膜厚分布平坦化のためのめっき槽形状の最適化(J02-3 逆問題解析手法の開発と最新応用(3),J02 逆問題解析手法の開発と最新応用)&quot;

Publication Information

Title

Japanese:	"2111 半導体めっきにおける膜厚分布平坦化のためのめっき槽形状の最適化(J02-3 逆問題解析手法の開発と最新応用(3),J02 逆問題解析手法の開発と最新応用)"
English:	2111 Optimization of the shape of plating bath to planarize thickness of the distribution in semiconductor plating

Author

Japanese:	天谷賢治.
English:	KENJI AMAYA.

Language

Japanese

Journal/Book name

Japanese:	年次大会講演論文集 : JSME annual meeting
English:	年次大会講演論文集 : JSME annual meeting

Volume, Number, Page

Vol. 2006 No. 6 pp. 105-106

Published date

2006

Publisher

Japanese:	社団法人日本機械学会
English:	The Japan Society of Mechanical Engineers

Conference name

Japanese:
English:

Conference site

Japanese:
English:

Official URL