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Publication Information
Title
Japanese:
槽内電位逆解析による電気銅めっき電流密度推定法とその検証実験
English:
An Estimation Method of Copper Electroplating Current Densities by Inverse Analysis of Electric Potentials in Cells and Its Experimental Verification
Author
Japanese:
天谷賢治
.
English:
KENJI AMAYA
.
Language
Japanese
Journal/Book name
Japanese:
日本機械学會論文集. A編
English:
Transactions of the Japan Society of Mechanical Engineers. A
Volume, Number, Page
Vol. 75 No. 757 pp. 1239-1246
Published date
2009
Publisher
Japanese:
社団法人日本機械学会
English:
The Japan Society of Mechanical Engineers
Conference name
Japanese:
English:
Conference site
Japanese:
3875008
English:
Official URL
http://ci.nii.ac.jp/naid/110007358708/
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Tokyo Institute of Technology All rights reserved.