High Performance Photoresist Planarization Process by CMP with Resin Abrasive for Trench-First Cu/Low-k Dual Damascene Process

Publication Information

Title

Japanese:
English:	High Performance Photoresist Planarization Process by CMP with Resin Abrasive for Trench-First Cu/Low-k Dual Damascene Process

Author

Japanese:	松井之輝, Satoko Seta, Masako Kinoshita, Yoshikuni Tateyama, Atsushi Shigeta, Takeshi Nishioka, Hiroyuki Yano, Hirotaka Shida, Kazuo Nishimoto, 益子正文.
English:	Yukiteru Matsui, Satoko Seta, Masako Kinoshita, Yoshikuni Tateyama, Atsushi Shigeta, Takeshi Nishioka, Hiroyuki Yano, Hirotaka Shida, Kazuo Nishimoto, Masabumi Masuko.

Language

English

Journal/Book name

Japanese:
English:	Journal of The Electrochemical Society

Volume, Number, Page

Vol. 156 No. 7 pp. H548-H554

Published date

May 2009

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI