STUDY ON PEELING BEHAVIOR OF ADHESIVE FILMS FOR SEMICONDUCTOR PACKAGES

Publication Information

Title

Japanese:
English:	STUDY ON PEELING BEHAVIOR OF ADHESIVE FILMS FOR SEMICONDUCTOR PACKAGES

Author

Japanese:	佐伯尚哉, 因幡和晃, 岸本喜久雄.
English:	Naoya SAIKI, Kazuaki INABA, K. Kishimoto.

Language

English

Journal/Book name

Japanese:
English:	Proceedings of Asian Pacific Conference for Materials and Mechanics 2009

Volume, Number, Page

pp. 1-4

Published date

Nov. 2009

Publisher

Japanese:
English:	JSME

Conference name

Japanese:
English:	Asian Pacific Conference for Materials and Mechanics 2009

Conference site

Japanese:
English:	Yokohama, Japan