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Title
Japanese: 
English:Mechanisms for Grip-and-Release Process of Adhesion Contact Using Material with Variable Elastic Modulus 
Author
Japanese: 関口 悠, 雷 磊, HEMTHAVY PASOMPHONE, 高橋 邦夫.  
English: Y. Sekiguchi, L. Lei, P. Hemthavy, K. Takahashi.  
Language English 
Journal/Book name
Japanese: 
English:Journal of Adhesion Science and Technology 
Volume, Number, Page Volume 24    Number 11-12    pp. 1819-1830
Published date Sept. 2010 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 
Official URL https://doi.org/10.1163/016942410X507597
 
DOI https://doi.org/10.1163/016942410X507597

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