Surface modification of silicon wafer by low-pressure high-frequency plasma chemical vapor deposition method

Publication Information

Title

Japanese:
English:	Surface modification of silicon wafer by low-pressure high-frequency plasma chemical vapor deposition method

Author

Japanese:	H. Kataoka, Mungkung Narong, 湯地敏史, M. Kawano, Y. Kiyota, D. Uesugi, K. Nakabayashi, 須崎嘉文, H. Shibata, N. Kashihara, K. Sakai, T. Bouno, 赤塚洋.
English:	H. Kataoka, N. Mungkung, T. Yuji, M. Kawano, Y. Kiyota, D. Uesugi, K. Nakabayashi, Y. Suzaki, H. Shibata, N. Kashihara, K. Sakai, T. Bouno, H. Akatsuka.

Language

English

Journal/Book name

Japanese:
English:	2010 24th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

Volume, Number, Page

pp. 505 - 508

Published date

Aug. 2010

Publisher

Japanese:
English:	IEEE

Conference name

Japanese:
English:	2010 24th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)

Conference site

Japanese:
English:	Braunschweig, Germany

Official URL

DOI