Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

Publication Information

Title

Japanese:
English:	Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

Author

Japanese:	篠田奈緒, 清水哲也, TSO-FU MARK CHANG, 柴田曉伸, 曽根正人.
English:	Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

pp. in press

Published date

Sept. 19, 2011

Publisher

Japanese:
English:	Elsevier

Conference name

Japanese:
English:	37th International Conference on Micro and Nano Engineering, (MNE2011)

Conference site

Japanese:
English:	Berlin