Application of wafer direct bonding technology to optical nonreciprocal devices

Publication Information

Title

Japanese:
English:	Application of wafer direct bonding technology to optical nonreciprocal devices

Author

Japanese:	水本哲弥, 武井亮平.
English:	T. Mizumoto, R. Takei.

Language

English

Journal/Book name

Japanese:
English:	IEEE Photonics Society 2011 Winter Topical Meeting Technical Digest

Volume, Number, Page

Published date

Jan. 10, 2011

Publisher

Japanese:
English:

Conference name

Japanese:
English:	IEEE Photonics Society 2011 Winter Topical Meeting

Conference site

Japanese:
English:	Keystone

DOI