Effect of wafer pre-cleaning and plasma irradiation to wafer surfaces for plasma-assisted surface activated bonding

Publication Information

Title

Japanese:
English:	Effect of wafer pre-cleaning and plasma irradiation to wafer surfaces for plasma-assisted surface activated bonding

Author

Japanese:	武井亮平, 吉田幸平, 水本哲弥.
English:	R. Takei, K. Yoshida, T. Mizumoto.

Language

English

Journal/Book name

Japanese:
English:	Japanese Journal of Applied Physics

Volume, Number, Page

vol. 49 no. 8

Published date

Aug. 10, 2010

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: