(Invited Paper) Application of Wafer Direct Bonding Technique to Optical Nonreciprocal Devices

Publication Information

Title

Japanese:
English:	(Invited Paper) Application of Wafer Direct Bonding Technique to Optical Nonreciprocal Devices

Author

Japanese:	水本哲弥, 武井亮平.
English:	T. Mizumoto, R. Takei.

Language

English

Journal/Book name

Japanese:
English:	IEEE Photonics Journal

Volume, Number, Page

vol. 3 no. 3 pp. 588-596

Published date

June 6, 2011

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI