Cu electroplating reaction using suspension of supercritical carbon dioxide in electroplating solution with Cu particles

Publication Information

Title

Japanese:
English:	Cu electroplating reaction using suspension of supercritical carbon dioxide in electroplating solution with Cu particles

Author

Japanese:	篠田奈緒, 清水哲也, TSO-FU MARK CHANG, 柴田曉伸, 曽根正人.
English:	Nao Shinoda, Tetuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:	Taiwan Supercritical Fluid Association (TSCFA)

Volume, Number, Page

p. 20

Published date

Oct. 3, 2011

Publisher

Japanese:
English:	Taiwan Supercritical Fluid Association (TSCFA)

Conference name

Japanese:
English:	Taiwan Supercritical Fluid Association (TSCFA)

Conference site

Japanese:	Tayui, Taiwan
English: