Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles

Publication Information

Title

Japanese:
English:	Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles

Author

Japanese:	篠田奈緒, 清水哲也, TSO-FU MARK CHANG, 柴田曉伸, 曽根正人.
English:	Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:	Thin Solid Films

Volume, Number, Page

Vol. 529 pp. 29-33

Published date

Jan. 15, 2013

Publisher

Japanese:
English:	Elsevier

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI