Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

Publication Information

Title

Japanese:
English:	Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

Author

Japanese:	篠田奈緒, 清水哲也, TSO-FU MARK CHANG, 柴田曉伸, 曽根正人.
English:	Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:	Microelectronic Engineering

Volume, Number, Page

Vol. 97C pp. 126-129

Published date

Aug. 27, 2012

Publisher

Japanese:
English:	Elsevier

Conference name

Japanese:
English:

Conference site

Japanese:
English: