A Study on Integration of MEMS and CMOS with Applying Flip-chip Assembly in Wireless Applications

Publication Information

Title

Japanese:
English:	A Study on Integration of MEMS and CMOS with Applying Flip-chip Assembly in Wireless Applications

Author

Japanese:	白根篤史, 伊藤浩之, 石原昇, 益一哉.
English:	Atsushi Shirane, Hiroyuki Ito, Noboru Ishihara, Kazuya Masu.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

Apr. 1, 2012

Publisher

Japanese:
English:

Conference name

Japanese:
English:	Materials Research Society Spring Meeting

Conference site

Japanese:
English:	San Francisco

Official URL