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Title
Japanese: 
English:Millimeter-Wave Passive Devices 
Author
Japanese: Hamid Kiumarsi, 伊藤 浩之, 石原 昇, 益一哉.  
English: Hamid Kiumarsi, Hiroyuki Ito, Noboru Ishihara, Kazuya Masu.  
Language English 
Journal/Book name
Japanese: 
English: 
Volume, Number, Page        
Published date Mar. 16, 2012 
Publisher
Japanese: 
English: 
Conference name
Japanese:電子情報通信学会 集積回路研究専門委員会 第28回 シリコンアナログRF研究会 
English: 
Conference site
Japanese:東京 
English: 
Official URL http://www-lab13.kuee.kyoto-u.ac.jp/RF/cfp/RFcfp_201203.htm
 
Abstract The increasingly highly doped, conductive substrates resulting in lossy on-chip passive components is one of the main drawbacks of standard CMOS processes which worsens with moving toward higher frequencies like 60 GHz. In this paper, a solution will be given based on WLP (Wafer Level Packaging) technology. Furthermore, the CMOS inductor and transformer design at 60 GHz is discussed.

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