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Title
Japanese:LTCC基板を用いた3次元集積化デジタルMEMS可変フィルタモジュール 
English:3D Integrated Digital MEMS Tunable Filter Module Using LTCC Wafer 
Author
Japanese: 井上 広章, ミイ シャオユウ, 藤原 隆之, 勝木 隆史, 豊田 治, 中澤 文彦, 高安 基大, 石原 昇, 益 一哉.  
English: Hiroaki Inoue, Mi Xiaoyu, Takayuki Fujiwara, Takashi Katsuki, Osamu Toyoda, Fumihiko Nakazawa, Motohiro Takayasu, Noboru Ishihara, Kazuya Masu.  
Language Japanese 
Journal/Book name
Japanese: 
English: 
Volume, Number, Page         pp. 7PM1-E-5
Published date Nov. 5, 2013 
Publisher
Japanese: 
English: 
Conference name
Japanese:応用物理学会集積化ＭＥＭＳ技術研究会 第５回集積化ＭＥＭＳシンポジウム 
English: 
Conference site
Japanese:宮城県 仙台市 
English: 
Official URL http://annex.jsap.or.jp/MEMS/
 
Abstract In this paper, we present a fully integrated 8-bit digital tunable filter module, which enables the center frequency and bandwidth tuning operate in the S band region and featuring a low insertion loss of less than 3.2dB and small size of 3.6 mm by 4.7mm. This tunable filter module is based on a LTCC interposer with the filter circuit directly formed on the front surface using MEMS technology. 6 MEMS switches and CMOS driving IC are mounted on front and reverse sides of the LTCC interposer by flip chip bonding technology. By developed integration technology, we verified prospect for wafer level heterogeneous integration for RF application.

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