Tokyo Tech Research Repository (T2R2)

Publication Information

Title

Japanese:	Cu/Ni電磁圧接材の波状接合界面形成挙動のSPH法による数値解析
English:

Author

Japanese:	西脇淳人, 原田陽平, 熊井真次.
English:	Junto Nishiwaki, Yohei Harada, SHINJI KUMAI.

Language

Japanese

Journal/Book name

Japanese:	講演概要CD
English:

Volume, Number, Page

p. 469

Published date

Mar. 21, 2014

Publisher

Japanese:
English:

Conference name

Japanese:	（公社）日本金属学会2014年春期講演大会（第154回）
English:

Conference site

Japanese:	東京
English:

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