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Title
Japanese: 
English:Multiscale seamless domain method for linear elastic and steady temperature problems 
Author
Japanese: 鈴木 良郎.  
English: Yoshiro Suzuki.  
Language English 
Journal/Book name
Japanese: 
English: 
Volume, Number, Page        
Published date 2014 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English:The International Conference on Computational Methods (ICCM) 
Conference site
Japanese: 
English:Cambridge 
Abstract A new meshfree numerical analysis, termed the seamless domain method (SDM), is applied in a multiscale technology. The SDM requires only coarse-grained points and does not need a stiffness equation, mesh, grid, cell, or element. The SDM is composed of two analyses. The first is a microscopic analysis of local simulation domain to obtain shape functions for interpolation of dependent-variable distributions and influence coefficients for calculation of interaction between the points. These allow an SDM solution to represent a heterogeneous material without homogenization. The second step is a macroscopic analysis of a seamless global domain without mesh or grid. Various numerical examples illustrated that the method worked out both steady temperature fields and linear elastic fields. Every SDM solution using only a few hundreds of points was as accurate as that from conventional finite element analysis using more than 200 thousands of node points.

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