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Publication Information
Title
Japanese:
Cu/Al爆発圧接材の接合プロセスと接合界面形態の数値解析
English:
Author
Japanese:
西脇淳人
,
相澤祐輔
,
原田陽平
,
熊井真次
.
English:
Junto Nishiwaki
,
Yusuke Aizawa
,
Yohei Harada
,
SHINJI KUMAI
.
Language
Japanese
Journal/Book name
Japanese:
スマートプロセス学会誌
English:
Volume, Number, Page
Vol. 4 No. 2 pp. 95-101
Published date
Mar. 1, 2015
Publisher
Japanese:
English:
Conference name
Japanese:
English:
Conference site
Japanese:
English:
DOI
https://doi.org/10.7791/jspmee.4.95
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Tokyo Institute of Technology All rights reserved.