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Title
Japanese:Ｃｕ/Ａｌ爆発圧接材の接合プロセスと接合界面形態の数値解析 
English: 
Author
Japanese: 西脇淳人, 相澤祐輔, 原田陽平, 熊井真次.  
English: Junto Nishiwaki, Yusuke Aizawa, Yohei Harada, SHINJI KUMAI.  
Language Japanese 
Journal/Book name
Japanese:スマートプロセス学会誌 
English: 
Volume, Number, Page Vol. 4    No. 2    pp. 95-101
Published date Mar. 1, 2015 
Publisher
Japanese: 
English: 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 
DOI https://doi.org/10.7791/jspmee.4.95

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