Semiconductor chip package and method of manufacturing the same

Publication Information

Title

Japanese:	Semiconductor chip package and method of manufacturing the same
English:	Semiconductor chip package and method of manufacturing the same

Author

Japanese:	Y.L. KIM, J. Lee, OMinho.
English:	Y.L. KIM, J. Lee, Minho O.

Language

English

Journal/Book name

Japanese:	US patent
English:	US patent

Volume, Number, Page

Published date

May 2009

Publisher

Japanese:	Google Patents
English:	Google Patents

Conference name

Japanese:
English:

Conference site

Japanese:
English:

Official URL