セラミックスフィラー添加高分子材料の熱伝導および電気絶縁特性の数値解析

Publication Information

Title

Japanese:	セラミックスフィラー添加高分子材料の熱伝導および電気絶縁特性の数値解析
English:	Numerical Analysis of Conductive Heat Transfer and Dielectric Properties on Ceramics Filler/Polymer Composites

Author

Japanese:	曽我宏輔, 齊藤卓志, 石川和紀, 佐藤勲, 川口達也.
English:	Kosuke Soga, Takushi Saito, Kzunori Ishikawa, Isao Satoh, Tatsuya Kawaguchi.

Language

Japanese

Journal/Book name

Japanese:	第53回日本伝熱シンポジウム講演論文集CD-ROM
English:

Volume, Number, Page

Paper-1729.pdf

Published date

May 24, 2016

Publisher

Japanese:
English:

Conference name

Japanese:	第53回日本伝熱シンポジウム
English:	53rd National Heat Transfer Symposium of Jpana

Conference site

Japanese:	大阪
English: