Evaluation and Modeling of Adhesion Layer in Shock-Protection Structure for MEMS Accelerometer

Publication Information

Title

Japanese:
English:	Evaluation and Modeling of Adhesion Layer in Shock-Protection Structure for MEMS Accelerometer

Author

Japanese:	山根大輔, 小西敏文, 佐布晃昭, 年吉洋, 曽根正人, 益一哉, 町田克之.
English:	Daisuke Yamane, Toshifumi Konishi, Teruaki Safu, Hiroshi Toshiyoshi, Masato Sone, Kazuya Masu, Katsuyuki Machida.

Language

English

Journal/Book name

Japanese:
English:	Microelectronics Reliability

Volume, Number, Page

Vol. 66 pp. 78-84

Published date

Nov. 1, 2016

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI