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Title
Japanese:第一原理計算による化合物半導体のドーピング限界の検討 
English: 
Author
Japanese: 西谷宣彦, 原田航, 熊谷悠, 赤松寛文, 大場史康.  
English: Nobuhiko Nishiya, Kou Harada, Yu Kumagai, Hirofumi Akamatsu, Fumiyasu Oba.  
Language Japanese 
Journal/Book name
Japanese: 
English: 
Volume, Number, Page        
Published date Sept. 21, 2016 
Publisher
Japanese: 
English: 
Conference name
Japanese:日本金属学会2016年(第159回)秋期講演大会 
English: 
Conference site
Japanese:豊中市 
English: 

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