III-V/Si Low Temperature Direct Bonding Technology for Photonic Device Integration on SOI

Publication Information

Title

Japanese:
English:	III-V/Si Low Temperature Direct Bonding Technology for Photonic Device Integration on SOI

Author

Japanese:	西山伸彦, 林侑介, 鈴木純一, 荒井滋久.
English:	Nobuhiko Nishiyama, Yuusuke Hayashi, Junichi Suzuki, Shigehisa Arai.

Language

English

Journal/Book name

Japanese:
English:

Volume, Number, Page

Published date

Feb. 28, 2017

Publisher

Japanese:
English:	IEEE

Conference name

Japanese:
English:	Electron Devices Technology and Manufacturing Conference 2017

Conference site

Japanese:
English:	Toyama