Local distribution of residual stress of Cu in LSI interconnect

Publication Information

Title

Japanese:
English:	Local distribution of residual stress of Cu in LSI interconnect

Author

Japanese:	Hisashi Sato, Nobuyuki Shishido, Shoji Kamiya, Kozo Koiwa, 大宮正毅, Masahiro Nishida, Takashi Suzuki, 中村友二, Takeshi Nokuo.
English:	Hisashi Sato, Nobuyuki Shishido, Shoji Kamiya, Kozo Koiwa, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo.

Language

English

Journal/Book name

Japanese:
English:	MaterialsLetters

Volume, Number, Page

Volume 136 Page 362-365

Published date

Dec. 1, 2014

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English: