Micro-Mechanical Property Evaluation of Electroplated Au-Cu Alloys toward Applications in MEMS Accelerometers

Publication Information

Title

Japanese:
English:	Micro-Mechanical Property Evaluation of Electroplated Au-Cu Alloys toward Applications in MEMS Accelerometers

Author

Japanese:	Tang Hao-Chun, 陳君怡, Chang Tso-Fu Mark, 山根大輔, 町田克之, 益一哉, 曽根正人.
English:	Hao-chun Tang, Chun-yi Chen, Tso-Fu Mark Chang, Daisuke Yamane, Katsuyuki Machida, Kazuya Masu, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:	SSI-21

Volume, Number, Page

Published date

June 18, 2017

Publisher

Japanese:
English:

Conference name

Japanese:
English:	21th International Conference on Solid State Ionics, SSI-21

Conference site

Japanese:
English:	Padua