Micro-Bending Testing of Electrodeposited Gold for Applications as Movable Components in MEMS Devices

Publication Information

Title

Japanese:
English:	Micro-Bending Testing of Electrodeposited Gold for Applications as Movable Components in MEMS Devices

Author

Japanese:	浅野啓介, Tang Hao-Chun, 陳君怡, 名越貴志, Chang Tso-Fu Mark, 山根大輔, 町田克之, 益一哉, 曽根正人.
English:	Keisuke Asano, Hao-Chun Tang, Chun-Yi Chen, Takashi Nagoshi, Tso-Fu Mark Chang, Daisuke Yamane, Katsuyuki Machida, Kazuya Masu, Masato Sone.

Language

English

Journal/Book name

Japanese:
English:	Microelectronic Engineering

Volume, Number, Page

Vol. 180 pp. 15-19

Published date

June 1, 2017

Publisher

Japanese:
English:

Conference name

Japanese:
English:

Conference site

Japanese:
English:

DOI