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Title
Japanese: 
English:A 60GHz-Band High-Efficiency Antenna with a Thick Resin Layer and Differentially Fed through a Hole in a Silicon Chip 
Author
Japanese: 及川 直也, 廣川 二郎, 中野 洋, 平地 康剛, H. ISONO, A. ISHII, 安藤 真.  
English: N. OIKAWA, J. HIROKAWA, H. NAKANO, Y. HIRACHI, H. ISONO, A. ISHII, M. ANDO.  
Language English 
Journal/Book name
Japanese: 
English:IEICE Transactions on Communications 
Volume, Number, Page Vol. 99    No. 1    pp. 27-32
Published date Jan. 2016 
Publisher
Japanese: 
English:The Institute of Electronics, Information and Communication Engineers 
Conference name
Japanese: 
English: 
Conference site
Japanese: 
English: 
DOI https://doi.org/10.1587/transcom.2015ISP0027
Abstract For the realization of a high-efficiency antenna for 60GHz-band wireless personal area network, we propose placing a CMOS RF circuit and an antenna on opposing sides of a silicon chip. They are connected with low loss by a coaxial-line structure using a hole opening in the chip. Since the CMOS circuit is driven differentially, a differential-feed antenna is used. In this paper, we design and measure a differential-feed square patch antenna on a silicon chip. To enhance the radiation efficiency, it is placed on a 200µm thick resin layer. The calculated radiation efficiency of 79% includes the connection loss. A prototype antenna is measured in a reverberation chamber, and its radiation efficiency is estimated to be about 81±3%.

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